Through-silicon vias for semicondcutor substrate and method of manufacture

ABSTRACT

A semiconductor component includes a semiconductor substrate having a top surface. An opening extends from the top surface into the semiconductor substrate. The opening includes an interior surface. A first dielectric liner having a first compressive stress is disposed on the interior surface of the opening. A second dielectric liner having a tensile stress is disposed on the first dielectric liner. A third dielectric liner having a second compressive stress disposed on the second dielectric liner. A metal barrier layer is disposed on the third dielectric liner. A conductive material is disposed on the metal barrier layer and fills the opening.

TECHNICAL FIELD

The disclosure relates generally to a semiconductor device, and moreparticularly to a structure and method for forming through-silicon vias.

BACKGROUND

Since the invention of integrated circuits, the semiconductor industryhas experienced continuous rapid growth due to constant improvements inthe integration density of various electronic components (i.e.,transistors, diodes, resistors, capacitors, etc.). For the most part,this improvement in integration density has come from repeatedreductions in minimum feature size, allowing more components to beintegrated into a given chip area.

These integration improvements are essentially two-dimensional (2D) innature, in that the volume occupied by the integrated components isessentially on the surface of the semiconductor wafer. Although dramaticimprovements in lithography have resulted in considerable improvementsin 2D integrated circuit formation, there are physical limitations tothe density that can be achieved in two dimensions. One of theselimitations is the minimum size needed to make these components. Also,when more devices are put into one chip, more complex designs arerequired.

An additional limitation comes from the significant increase in thenumber and lengths of interconnections between devices as the number ofdevices increases. When the number and the lengths of interconnectionsincrease, both circuit RC delay and power consumption increase.

Among the efforts for resolving the above-discussed limitations,three-dimensional integrated circuit (3D IC) and stacked dies arecommonly used. Through-silicon vias (TSVs) are thus used in 3D IC andstacked dies for connecting dies. In this case, TSVs are often used toconnect the integrated circuits on a die to the backside of the die. Inaddition, TSVs are also used to provide short grounding paths forgrounding the integrated circuits through the backside of the die, whichmay be covered by a grounded metallic film.

The formation of the TSVs requires more process steps. The integratedcircuit formation thus becomes more complicated, and hence problems mayoccur. New methods for forming TSVs are thus needed to continuouslyimprove the TSV formation process.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIG. 1 is a flowchart of a method for fabricating through-silicon viasaccording to embodiments of the disclosure.

FIGS. 2 to 9 are cross-sectional views for forming through-silicon viasat various stages of manufacture according to FIG. 1.

DETAILED DESCRIPTION

It is to be understood that the following disclosure provides manydifferent embodiments, or examples, for implementing different featuresof the disclosure. Specific examples of components and arrangements aredescribed below to simplify the present disclosure. These are, ofcourse, merely examples and are not intended to be limiting. Moreover,the formation of a first feature over, above, or on a second feature inthe description that follows may include embodiments in which the firstand second features are formed in direct contact, and may also includeembodiments in which additional features may be formed interposing thefirst and second features, such that the first and second features maynot be in direct contact. Various features may be arbitrarily drawn indifferent scales for simplicity and clarity.

Illustrated in FIG. 1 is a flowchart of a method 11 for fabricating asemiconductor component with through-silicon vias according toembodiments of the disclosure. FIG. 2 to FIG. 9 are cross-sectionalviews showing various stages during fabrication of a semiconductorcomponent 100 with through-silicon vias according to one or moreembodiments according to FIG. 1. It is noted that some processes mayonly be briefly described herein for the sake of simplicity and clarity.Accordingly, it is understood that additional processes may be providedbefore, during, and after the method 11 of FIG. 1.

Referring now to FIG. 1, method 11 for fabricating a semiconductorcomponent with through-silicon vias begins with operation 13. Atoperation 13, a semiconductor substrate is provided. A plurality of diesare fabricated on a semiconductor substrate. The dies on thesemiconductor substrate are divided by scribe lines between the dies.The term “semiconductor substrate” herein generally refers to thesemiconductor bulk substrate on which various layers and devicestructures may or may not be formed. In some embodiments, thesemiconductor bulk substrate includes silicon or a compoundsemiconductor, such as GaAs, InP, Si/Ge, or SiC. Examples of such layersinclude dielectric layers, doped layers, polysilicon layers orconductive layers. Examples of device structures include transistors,resistors, and/or capacitors, which may or may not be interconnectedthrough an interconnect layer to additional active circuits.

Next, method 11 continues with operation 15 in which the semiconductorsubstrate is patterned to form an opening in the semiconductorsubstrate.

Referring to FIG. 2, a magnified view of a portion of the semiconductorcomponent 100 with a semiconductor substrate 101 is provided. Thesemiconductor substrate 101 having a top surface 102. A plurality ofopenings 103 are formed, extending through the top surface 102 into apredetermined depth of semiconductor substrate 101. In this example,only one opening 103 is shown for illustration purposes. In at least oneembodiment, the opening 103 comprises a depth in a range of about 5 μmto about 150 μm, and a width in a range of about 1 μm to about 20 μm.The opening 103 comprises an interior surface 105, which is consisted ofsidewalls, and a bottom surface 106 of the opening 103. The opening 103further comprises a top portion 107 and a bottom portion 109. The topportion 107 is adjacent to the topmost of the opening 103 and also closeto the top surface 102 of the semiconductor substrate 101. The bottomportion 109 is adjacent to the bottommost of the opening 103 and alsoclose to the bottom surface 106 of the opening 103.

In one embodiment, the opening 103 may be formed by a dry etchingprocess. Alternatively, the opening 103 may be formed by laser drilling.In one embodiment, a patterned masking layer (not shown) is formed overthe semiconductor substrate 101 to cover the un-removed areas and exposeportions of the semiconductor substrate 101 to enable the formation ofthe opening 103. The masking layer may be a hardmask comprising siliconnitride, oxide, or oxynitride formed through a process such as chemicalvapor deposition (CVD). Once formed, the masking layer is patternedthrough suitable photolithographic and etching processes to expose thoseportions of the semiconductor substrate 101 that will form the opening103. Then, the exposed semiconductor substrate 101 is removed by etchingor laser drilling to form the opening 103. In another embodiment, apatterned and developed photoresist, may alternatively be utilized toprotect the un-removed areas of the semiconductor substrate 101 whileexposing portions of the substrate 101 to be removed to form the opening103.

Referring back to FIG. 1, method 11 continues with operation 17 in whicha first dielectric liner is deposited by a plasma enhanced chemicalvapor deposition (PECVD) on the interior surface of the opening.

FIG. 3 illustrates the stage of operation 17 in which a cross-sectionalview of the semiconductor component 100 is provided. A first dielectricliner 111 is formed on the interior surface 105 of the opening 103. Thefirst dielectric liner 111 has a thickness T₁ on the top portion 107 ofthe opening 103 and a thickness T₂ on the bottom portion 109 of theopening 103. The thickness T₁ is in a range of about 200 Å to about 2000Å, and the thickness T₂ is in a range of about 20 Å to about 200 Å. Thefirst dielectric liner 111 becomes thinner gradually from the topportion 107 to the bottom portion 109. A ratio R₁ of the thickness T₁ tothe thickness T₂ is about 5 to about 20. The first dielectric liner 111may include silicon oxide, silicon nitride, silicon oxynitride, or PSG.

In one embodiment, the first dielectric liner 111 is formed by PECVD. Inthis example, a silicon oxide layer is formed as the first dielectricliner in a plasma environment comprising O₃ and TEOS. The flow rates ofO₃ and TEOS are in a range of about 5000 standard cubic centimeters perminute (seem) to about 10000 sccm, and of about 500 milligram per minute(mgm) to about 3000 mgm, respectively. An operation power of the plasmaenvironment uses high frequency RE power set at about 300 W to about 500W at 1156 MHz, and low frequency RE power set at about 50 W to about 150W at 350 kHz. An operation pressure of the plasma environment is about 2Torr to about 8 Torr. An operation temperature on the substrate 101 ofthe semiconductor component 100 is about 150° C. to about 450° C. Underthe above described conditions, the first dielectric liner 111 is formedwith a first compressive stress within a range of about 100 MPa to about400 MPa. The first dielectric liner 111 has a first etching rate ofabout 1 Å/min to about 10 Å/min in a HF solution, which is diluted at arate of 1000:1. This disclosure is not limited to the above conditionsfor forming first dielectric liner 111, and differing conditions thatproduce either the above compressive stress or the above etch rate arewithin the scope of this disclosure.

PECVD uses a radio frequency (RF) power to generate a glow discharge totransfer the energy into the reactant gases, allowing the deposition onthe interior surface 105 of the opening 103 and the top surface 102 ofthe semiconductor substrate 101 at a lower temperature. It is believedthat the radicals with high energy in the plasma of PECVD repair thedamaged interior surface 105 during operation 15 for the opening 103formation. The dangling bonds and the defects on the interior surface105 are removed. The interface between the first dielectric liner 111and the interior surface 105 has fewer defects than conventionalmethods. Thus, desirable properties such as good adhesion, low pinholedensity and adequate electrical properties of the deposited firstdielectric liner 111 are produced.

Referring back to FIG. 1, method 11 continues with operation 19 in whicha second dielectric liner is deposited by a conformal deposition on thefirst dielectric liner.

FIG. 4 illustrates the stage of operation 19 in which a seconddielectric liner 113 is formed on the first dielectric liner 111. Thesecond dielectric liner 113 has a thickness T₃ on the top portion 107 ofthe opening 103 and a thickness T₄ on the bottom portion 109 of theopening 103. The thickness T₃ is in a range of about 500 Å to about 2500Å, and the thickness T₄ is in a range of about 500 Å to about 2500 Å, inone embodiment, the second dielectric liner 113 may be a completelyconformal liner, some variation in the conformality of the second linerthickness has been found to have beneficial effects. A ratio R₂ of thethickness T₃ to the thickness T₄ is about 1 to about 5. Within the rangeof the ratio R2, the second dielectric liner 113 still maintainbeneficial effects of conformality.

In one embodiment, the second dielectric liner 113 is formed by highaspect ratio process (HARP) using an O₃/TEOS based sub atmosphericchemical vapor deposition process. In this example, an oxide layer isformed as the second dielectric liner. The flow rates of O₃ and TEOS arebe in a range of about 10000 standard cubic centimeters per minute(seem) to about 20000 seem, and of about 500 mgm to about 3500 mgm,respectively. An operation pressure is about 400 Torr to about 650 Torr.An operation temperature on the semiconductor component 100 is about200° C. to about 450° C. The reactants are heated under the operationtemperature without plasma and deposit on the first dielectric liner111. Under the above described condition, the second dielectric liner113 is formed with a tensile stress within a range of about 50 MPa toabout 300 MPa. The second dielectric liner 113 has a second etching rateof about 10 Å/min to about 50 Å/min in a HF solution, which is dilutedat a rate of 1000:1. Alternatively, the second dielectric liner 113 maybe formed by using a conformal deposition technique, such as atomiclayer deposition (ALD) or a spin on dielectric (SOD) such as a silicate,a siloxane, a methyl Silses uioxane (MSQ), a hydrogen SisesQuioxane(HSQ), an MSQ/HSQ, a perhydrosilazane (TCPS) or a perhydro-polysilazane(PSZ).

This disclosure is not limited to the above conditions for forming thesecond dielectric liner 113, and different conditions that produceeither the above compressive stress or the above etch rate are withinthe scope of this disclosure.

According to the above description, the ratio R₁ is greater than theratio R₂. The second dielectric liner 113 has better conformality thanthe first dielectric liner 111. The second dielectric liner 113 smoothsover the variation of the thickness of the combined layer of liner 111and liner 113. The first etching rate is less than the second etchingrate. Hence, the first dielectric liner 111 has a lower pinhole densitythan the second dielectric liner 113. The first dielectric liner 111provides protection from moisture or contaminations diffuse from thesemiconductor substrate 101 into the second dielectric liner 113.

Referring back to FIG. 1, method 11 continues with operation 21 in whicha third dielectric liner is deposited by a plasma enhanced chemicalvapor deposition (PECVD) on the second dielectric liner.

FIG. 5 illustrates the stage of operation 21 in which a cross-sectionalview of the semiconductor component 100 is provided. A third dielectricliner 115 is formed on the second dielectric liner 113. The thirddielectric liner 115 has a thickness T₅ on the top portion 107 of theopening 103 and a thickness T₆ on the bottom portion 109 of the opening103. The thickness T₅ is in a range of about 200 Å to about 2000 Å, andthe thickness T₆ is in a range of about 20 Å to about 200 Å. The thirddielectric liner 115 becomes thinner gradually from the top portion 107to the bottom portion 109. A ratio R₃ of the thickness T₅ to thethickness T₆ is about 5 to about 20. The third dielectric liner 115 mayinclude silicon oxide, silicon nitride, silicon oxynitride, or PSG.

In one embodiment, the third dielectric liner 115 is formed by PECVD. Inthis example, a silicon oxide layer is formed as the third dielectricliner in a plasma environment comprising O₃ and TEOS. The flow rates ofO₃ and TEOS are in a range of about 5000 standard cubic centimeters perminute (seem) to about 10000 sccm, and of about 500 mgm to about 3000mgm, respectively. An operation power of the plasma environment useshigh frequency RF power set at about 300 W to about 500 W at 1.3.56 MHz,and low frequency RF power set at about 50 W to about 150 W at 350 kHz.An operation pressure of the plasma environment is about 2 Torr to about8 Torr. An operation temperature on the semiconductor component 100 isabout 150° C. to about 450° C. Under the above described condition, thethird dielectric liner 115 is formed with a second compressive stresswithin a range of about 100 MPa to about 400 MPa. The third dielectricliner 115 has a third etching rate of about 1 Å/min to about 10 Å/min ina HF solution, which is diluted at a rate of 1000:1.

This disclosure is not limited to the above conditions for the formationof third dielectric liner 115, and other conditions that produce eitherthe above compressive stress or the above etch rate are within the scopeof this disclosure.

In one embodiment, the first dielectric liner 111 and the thirddielectric liner 115 comprise the same dielectric material. The firstcompressive stress of the first dielectric liner 111 and the secondcompressive stress of the third dielectric liner 115 are equal. Inanother embodiment, the first dielectric liner 111 and the thirddielectric liner 115 comprise different dielectric materials. The firstcompressive stress of the first dielectric liner 111 and the secondcompressive stress of the third dielectric liner 115 are different. Atleast one of the first compressive stress and the second compressivestress is within a range of about 100 MPa to about 400 MPa.

According to the above description, the third etching rate is less thanthe second etching rate. The third dielectric liner 115 may have a lowerpinhole density than the second dielectric liner 113. The thirddielectric liner 115 is formed between the second dielectric liner 113and the later formed metal barrier layer 117 (shown in FIG. 6). Thethird dielectric liner 115 provides protection from contaminationsdiffuse from the later formed metal barrier layer 117 and the conductivematerial 119 into the semiconductor substrate 101. A robust electricalperformance of the semiconductor component 100 is provided.

Referring back to FIG. 1, method 11 continues with operation 23 in whicha metal barrier layer is deposited on the third dielectric liner.

FIG. 6 illustrates the stage of operation 23 in which a cross-sectionalview of the semiconductor component 100 is provided. A metal barrierlayer 117 is formed on the third dielectric liner 115. The metal barrierlayer 117 may provide protection from metal ions, contaminations diffusefrom the later formed conductive material 119 into the semiconductorsubstrate 101. The metal barrier layer 117 comprises tantalum nitride,although other materials, such as tantalum, titanium, titanium nitride,combinations of these, may alternatively be used. The formation methodsof the metal barrier layer 117 include ALD, PECVD, or physical vapordeposition (PVD) processes.

Referring back to FIG. 1, method 11 continues with operation 25 in whichthe remaining opening after the deposition of the three dielectricliners and the metal barrier layer is filled with a conductive material.

Referring to FIG. 7, the remaining opening 103 after the deposition ofthe three dielectric liners and the metal harrier layer 117 is filledwith a conductive material 119. The conductive material 119 may overfillthe remaining opening 103 and the metal barrier layer 117. Theconductive material 119 may include copper or copper alloys. However,other metals, such as aluminum, silver, gold, and combinations thereof,may also be used. The possible formation methods include electrolessplating, or other commonly used deposition methods such as sputtering,printing, electro plating, and chemical vapor deposition (CVD).

Referring back to FIG. 1, method 11 continues with operation 27 in whichthe excess conductive material 119, the metal barrier layer 117 and thethree dielectric liners outside of the opening 103 is optionallyremoved.

FIG. 8 illustrates the stage of operation 27 in which a cross-sectionalview of the semiconductor component 100 is provided. The excessmaterials outside of the opening 103 are removed through a suitableprocess such as chemical mechanical polishing (CMP), an etching, or acombination of polishing and etching. The removal process preferablyremoves any conductive material 119 that is located over the metalharrier layer 117 and the three dielectric liners 111, 113 and 115 aswell, so that the removal of excess materials will expose the topsurface 102 of the semiconductor substrate 101 for further processsteps. A through-silicon via 120 with the conductive material 119 filledin the opening 103 is formed.

In some embodiments, further process steps are optionally followed afterthe operation 27. Metallization layers (not shown) may be formed overthe top surface 102 of the substrate 101 and are designed to connect thedevice structures (not shown) in the semiconductor component 100 to formfunctional circuitry and also to form a connection to the opposite sideof the substrate 101 through the TSV 120. The metallization layers maybe formed of alternating layers of dielectric and conductive materialand may be formed through any suitable process (such as deposition, dualdamascene).

Referring back to FIG. 1, method 11 continues with operation 29 in whicha thinning process performed over the backside of the substrate toexpose the TSV.

FIG. 9 illustrates the stage of operation 29 in which a cross-sectionalview of the semiconductor component 100 is provided. A portion of thebackside of the semiconductor substrate 101 is then removed to exposethe conductive material 119 located within the opening 103 to completethe TSV 120. The removal may be performed with a grinding process suchas a Chemical mechanical polish (CMP), although other suitableprocesses, such as etching, may alternatively be used. The removal ofthe backside of the substrate 101 may be continued until the substrate101 has a thickness of between about 10 μm and about 200 μm. Thereafter,the TSV 120 is exposed from backside of the substrate 101. Thethrough-silicon via (TSV) 120 provides electrical connection for thesemiconductor component formed on substrate 101 to other components.

Various embodiments of the present invention may be used to improve theconventional through-silicon via structures. For example, in the variousembodiments the first dielectric liner 111 formed by PECVD repairs thedamaged interior surface 105 of the opening 103. The first dielectricliner 111 provides protection from contaminations diffuse from thesubstrate 101 into the second dielectric liner 113 and inner layers 115,117 and 119. The second dielectric liner 113 with conformal thicknesssmoothes over the variation of the thickness of the combined layer ofliners 111, 113 and 115. The compressive stresses of the firstdielectric liner and the third dielectric liner in combination with thetensile stress in the second dielectric liner adjust the overall stressin the TSV 120 The leakage current, device performance and yield on thecompleted products are thus significantly increased.

Although, the semiconductor component having through-silicon vias andthe method of making the same are described according variousembodiments of the present disclosure, other alternatives, replacementsor modifications may present without departure from the spirit of thepresent disclosure.

An embodiment of the disclosure provides a semiconductor component. Thesemiconductor component includes a semiconductor substrate having a topsurface. An opening extends from the top surface into the semiconductorsubstrate. The opening includes an interior surface. A first dielectricliner having a first compressive stress is disposed on the interiorsurface of the opening. A second dielectric liner having a tensilestress is disposed on the first dielectric liner. A third dielectricliner having a second compressive stress disposed on the seconddielectric liner. A metal barrier layer is disposed on the thirddielectric liner. A conductive material is disposed on the metal barrierlayer and fills the opening.

The present disclosure also provides another embodiment of asemiconductor component. The semiconductor component includes asemiconductor substrate having a top surface. An opening having aninterior surface extends from the top surface into the semiconductorsubstrate. The opening has a top and a bottom. A first dielectric lineris disposed on the interior surface of the opening. The first dielectricliner has a thickness T₁ on the top and a thickness T₂ on the bottom. R₁is a ratio of T₁ to T₂. A second dielectric liner is disposed on thefirst dielectric liner. The second dielectric liner has a thickness T₃on the top and a thickness T₄ on the bottom, R₂ is a ratio of T₃ to T₄,and R₁ is greater than R₂, A third dielectric liner is disposed on thesecond dielectric liner. The third dielectric liner has a thickness T₅on the top and a thickness T₆ on the bottom. T₅ is greater than T₆. Ametal barrier layer is disposed on the third dielectric liner. Aconductive material is disposed on the metal barrier layer and fills theopening.

The present disclosure also provides another embodiment of a method offorming a semiconductor component. The method includes providing asemiconductor substrate having a top surface. An opening having aninterior surface extending from the top surface into the semiconductorsubstrate is formed. The opening has a top and a bottom. A firstdielectric liner is deposited on the interior surface by a plasmaenhanced chemical vapor deposition (PECVD). A second dielectric liner isdeposited on the first dielectric liner by a conformal deposition. Athird dielectric liner is deposited on the second dielectric liner by aPECVD. A metal barrier layer is deposited on the third dielectric liner.The remaining opening after the deposition of the three dielectricliners and the metal barrier layer is filled with a conductive material.

Although the embodiments and its advantages have been described indetail, it should be understood that various changes, substitutions andalterations can be made herein without departing from the spirit andscope of the invention as defined by the appended claims. Moreover, thescope of the present application is not intended to be limited to theparticular embodiments of the process, machine, manufacture, andcomposition of matter, means, methods and steps described in thespecification. As one of ordinary skill in the art will readilyappreciate from the disclosure of the present invention, processes,machines, manufacture, compositions of matter, means, methods, or steps,presently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein may be utilized according tothe present invention. Accordingly, the appended claims are intended toinclude within their scope such processes, machines, manufacture,compositions of matter, means, methods, or steps.

1. A semiconductor component comprising: a semiconductor substratehaving a top surface; an opening extending from the top surface into thesemiconductor substrate, wherein the opening comprises an interiorsurface; a first dielectric liner having a first compressive stressdisposed on the interior surface of the opening; a second dielectricliner having a tensile stress disposed on the first dielectric liner; athird dielectric, liner having a second compressive stress disposed onthe second dielectric liner; a metal barrier layer disposed on the thirddielectric liner; and a conductive material disposed on the metalbarrier layer and filling the opening.
 2. The semiconductor component ofclaim 1, wherein the first dielectric liner and the third dielectricliner comprise the same dielectric material.
 3. The semiconductorcomponent of claim 1, wherein the first dielectric liner and the thirddielectric liner comprise different dielectric materials.
 4. Thesemiconductor component of claim 1, wherein the first compressive stressand the second compressive stress are equal.
 5. The semiconductorcomponent of claim 1, wherein the first compressive stress and thesecond compressive stress differ from each other.
 6. The semiconductorcomponent of claim 1, wherein at least one of the first compressivestress and the second compressive stress is within a range of 100 MPa to400 MPa.
 7. The semiconductor component of claim 1, wherein the tensilestress is within a range of 50 MPa to 300 MPa.
 8. The semiconductorcomponent of claim 1, wherein the first dielectric liner has a firstetching rate in a HF solution, the second dielectric liner has a secondetching rate in the solution, and the first etching rate is less thanthe second etching rate.
 9. The semiconductor component of claim 8,wherein the third dielectric liner has a third etching rate in the HFsolution, and the third etching rate is less than the second etchingrate.
 10. A semiconductor component comprising: a semiconductorsubstrate having a top surface; an opening having an interior surfaceextending from the top surface into the semiconductor substrate, whereinthe opening has a top portion and a bottom portion; a first dielectricliner disposed on the interior surface of the opening, the firstdielectric liner having a thickness T₁ on the top portion and athickness T₂ on the bottom portion, wherein R₁ is a ratio of T₁ to T₂; asecond dielectric liner disposed on the first dielectric liner, thesecond dielectric liner having a thickness T₃ on the top portion and athickness T₄ on the bottom portion, wherein R₂ is a ratio of T₃ to T₄,and R₁ is greater than R₂; a third dielectric liner disposed on thesecond dielectric liner, the third dielectric liner having a thicknessT₅ on the top portion and a thickness T₆ on the bottom portion, whereinT₅ is greater than T₆; a metal barrier layer disposed on the thirddielectric liner; and a conductive material disposed on the metalbarrier layer and filling the opening.
 11. The semiconductor componentof claim 10, wherein the ratio R₁ is about 5 to about
 20. 12. Thesemiconductor component of claim 10, wherein the ratio by is about 1 toabout
 5. 13. The semiconductor component of claim 10, wherein a ratio R₃of T₅ to T₆ is about 5 to about
 20. 14. The semiconductor component ofclaim 10, wherein the first dielectric liner has a first etching rate ina HF solution, the second dielectric liner has a second etching rate inthe HF solution, and the first etching rate is less than the secondetching rate.
 15. The semiconductor component of claim 14, wherein thethird dielectric liner has a third etching rate in the HF solution, andthe third etching rate is less than the second etching rate.
 16. Thesemiconductor component of claim 10, wherein the first dielectric linerhas a first compressive stress and the third dielectric liner has asecond compressive stress, and at least one of the first compressivestress and the second compressive stress is within a range of 100 MPa to400 Mpa.
 17. The semiconductor component of claim 10, wherein the seconddielectric liner has a tensile stress.
 18. The semiconductor componentof claim 17, wherein the tensile stress is within a range of 50 MPa to300 MPa.
 19. A method for forming a semiconductor component comprising;providing a semiconductor substrate having a top surface; forming anopening having an interior surface extending from the top surface intothe semiconductor substrate, wherein the opening has a top portion and abottom portion; depositing a first dielectric liner on the interiorsurface by a plasma enhanced chemical vapor deposition (PECVD);depositing a second dielectric liner on the first dielectric liner by aconformal deposition; depositing a third dielectric liner on the seconddielectric liner by a PECVD; depositing a metal barrier layer on thethird dielectric liner; and filling the remaining opening after thedeposition of the three dielectric liners and the metal barrier layerwith a conductive material.
 20. The method of claim 19, wherein thesecond dielectric liner has a thickness T3 on the top portion and athickness 14 on the bottom portion, and a ratio R2 of T3 to T4 is about1 to about 5.